Derek Feng

Derek Feng, P.E. is a thermal engineer who currently serves as a Mechanical Engineering Technical Leader at Cisco. They have previously held positions such as Thermal Engineer at Cisco Meraki and Mechanical Engineer at Northrop Grumman, where they conducted thermal and structural analyses for various applications. Derek's experience also includes work at Oracle, Dell EMC, and Qorvo, where they developed and evaluated thermal solutions for advanced systems. They hold a Master’s degree in Mechanical Engineering from Stanford University and a Bachelor’s degree from the University of California, Los Angeles.