Jing Wu is a Signal Integrity Engineer at Cisco Systems since November 2008, leading efforts in ASIC package design and high-speed routing for various Cisco products, including the UCS and N6000 series. Previous experience includes a Senior Packaging Engineer role at Spansion, Inc., where electrical modeling and SSO simulation were key responsibilities, and an Advanced Signal Integrity Engineer position at Altera Corporation, focusing on SSN characterization and design guidelines for silicon devices. Jing Wu holds a Master's Degree in Electrical Engineering with an emphasis in Signal Integrity and Electromagnetic Compatibility from the University of Missouri-Rolla, as well as a Ph.D. in Condensed Matter and Materials Physics from the Institute of Physics, Chinese Academy of Science.
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