Xuejiao Huang

Xuejiao Huang is a Thermal Packaging Engineer at Compound Semiconductor Applications (CSA) Catapult with previous experience as a Senior Module Design Engineer at Dynex Semiconductor Ltd. They also worked as a Postdoctoral Research Associate at Lancaster University, focusing on structural design and microfabrication of vacuum electronic devices. Xuejiao holds a PhD in Computational and Applied Mechanics from Queen Mary University of London, a Master's degree in Geotechnical and Geoenvironmental Engineering, and a Bachelor's degree in Civil Engineering from Central South University.