Corintis
Andrea Francescon is currently the Head of Hardware Engineering at Corintis, focusing on integrated silicon microfluidic cooling for advanced chip thermal management. Previous experience includes serving as a Research & Innovation Engineer at KEP Technologies, where research on scientific instruments for thermal analysis was conducted, and as a Senior Research Fellow at CERN, specializing in detector integration and thermal management. Early career roles included a Doctoral Student position at CERN, investigating cooling solutions for electronics, and an internship involving experimental tests on the ALICE Silicon Pixel Detector. Andrea holds an MBA from the University of Geneva, a PhD in Industrial Engineering from Università degli Studi di Padova, and a Master's degree in Energy Engineering from the same institution.
This person is not in any offices
Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.