Corintis
Athanasios Boutsikakis is a Computational Simulations and Modeling Engineer at Corintis since July 2022, focusing on computational acceleration through reduced-order modeling and Scientific ML for microfluidic cooling solutions for semiconductors. Previously, as a Postdoctoral Associate at TotalEnergies from October 2020 to June 2022, Boutsikakis designed and simulated multiphase flow case studies in the oil transport industry and performed DNS of two-phase flows. During the PhD candidacy at Institut de Mécanique des Fluides de Toulouse from October 2017 to September 2020, Boutsikakis developed the open-source Python library PYECP for simulating charged granular flows and integrated electrostatic algorithms into a Fortran/MPI code. Boutsikakis also served as a Teaching Assistant at ENSEEIHT, contributed as a Research Engineer at ONERA, and worked as a Mechanical Engineer at Innora SA, where innovative designs and mathematical modeling were key aspects. Boutsikakis holds a PhD in Fluid Dynamics from Toulouse INP, a Master’s Degree in Aerospace Engineering from ISAE-SUPAERO, and a Master of Engineering in Mechanical Engineering from the National Technical University of Athens.
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.