Corintis
Nicola Esposito is a Full Stack Software Engineer at Corintis, specializing in the development of computational simulation platforms utilizing Spring and ReactJS, and gaining experience with the Rescale API for High-Performance Computing on the AWS platform since September 2022. Prior to this, Nicola served as a Junior HPC Software Engineer and software developer at DXT Commodities SA from September 2019 to May 2022, focusing on the research and development of high-performance computing clusters and parallel optimization tools for energy forecasting applications. Additionally, Nicola completed a summer research project at USI Università della Svizzera italiana in July 2020, analyzing power grid simulation packages for their deployment in massively parallel computations. Academically, Nicola holds a Master's degree in Computational Science from USI (2020-2022) and a Master's degree in Computational Engineering from FAU Erlangen-Nürnberg (2020-2022), as well as a Bachelor's degree in Informatics from USI (2017-2020) and a Diploma in Informatics from ITIS Magistri Cumacini (2012-2017).
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.