Corintis
Remco van Erp is the Co-Founder and CEO of Corintis, a company focused on developing innovative chip technology to advance computing. Van Erp has a robust academic background, having completed a PhD in Electrical Engineering at the Ecole polytechnique fédérale de Lausanne, specializing in Power and Wide-band-gap Electronics. Previous experience includes a visiting graduate student researcher position at the Wyss Institute for Biologically Inspired Engineering, where research focused on microfluidic immunosensors, and an internship at Osaka University, concentrating on wearable microfluidic biosensors. Van Erp also worked as a Suspension & Dynamics Engineer at Automotive Technology InMotion, utilizing MATLAB and Simulink for modeling and optimization. Education includes a Master of Science in Mechanical Engineering and a Bachelor of Science in Mechanical Engineering from Eindhoven University of Technology, along with a VWO diploma from Elzendaalcollege.
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Corintis
The biggest challenges of our lifetime, from climate change modeling to drug discovery, constantly require more computing power. For decades, chipmakers relied on making transistors in integrated circuits smaller, and packing more of them together, to achieve more powerful and efficient chips. However, all power that goes into these billions of transistors is turned into heat. This heat needs to be extracted, as overheating causes chips to fail and lose performance. With transistors approaching the size of a few atoms, extracting this highly concentrated heat is rapidly becoming a bottleneck for the next generations of computing. In addition, cooling of chips accounts for about 30% of electricity consumption in data centers, causing an enormous environmental footprint. Sustainable and high-performance heat extraction is key to satisfy our ever-increasing demand for computational power. We are a provider of breakthrough semiconductor cooling solutions. Our solution utilizes a network of microscopically small cooling channels embedded inside the chip, which enables us to extract 10 times more heat compared to the current leading market alternatives, and extract this heat over 50x more energy efficiently. This enables the powerful integrated circuits of the future to break thermal limitations in a sustainable manner.