Eric Hsieh is a Senior Firmware Engineer at 台達電子, where they focus on audio and USB driver software engineering, including BSP audio and USB driver porting, and resolving user experience issues. Previously, they worked as a Senior FAE Engineer at Cywee Motion, handling Android sensor hub porting and MCU RTOS debugging from 2015 to 2018, and as a Senior Engineer at Foxconn from 2007 to 2015. Eric holds a Master of Engineering in Mechanical Engineering from National Taiwan University of Science and Technology, earned between 2003 and 2005.
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