Phylicia Yap is a Mechanical Engineer at Dexcom, where they currently focus on equipment engineering. Previously, they worked as a Test R&D Engineer and Supply Chain Engineer at Intel Corporation from 2015 to 2021, contributing to thermal and mechanical equipment design, system integration, and supplier management. Prior to that, Phylicia held the position of Mechanical Engineer at CUBE Technology, Inc from 2012 to 2013. They are pursuing a Bachelor of Science in Mechanical Engineering at the University of Southern California.
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