Phil Mao

Phil Mao is an experienced professional in the semiconductor industry, currently serving as the Wafer Process & Products Sustaining Engineering Manager at Diodes Inc since April 2006. Responsibilities include overseeing back grinding and back metal operations, managing engineering, equipment, materials, and output, utilizing tools such as Accretech PG200RM and Disco DFG8540 grinders. Previously, Phil held roles as Wafer Section Manager, Senior Wafer Engineer, and Wafer Engineer. Between July 2003 and March 2006, Phil worked at BCDsemi as a Product Engineer, focusing on the development of diodes, transistors, and MOSFETs, along with new die layout design, wafer process integration, and improvements in wafer yield and quality. Phil earned a Bachelor’s degree in Microelectronics from Zhejiang University from 1999 to 2003.