Nick Tseng

Nick Tseng is a seasoned professional in the semiconductor and advanced materials industry, currently serving as Global Marketing Manager at 台灣杜邦股份有限公司 since June 2019. In this role, Nick has successfully managed segment P&L and spearheaded transformation initiatives in the Dielectric segment, focusing on 3D IC advanced packaging applications. Prior experience includes positions as Taiwan Sales Director at both 台灣杜邦股份有限公司 and 陶氏化學, where Nick led sales teams across Taiwan and Greater China. Additional roles at Merck Electronics, Touch Micro-System Technology Corp., and Nanya Technology highlight a strong background in product management, technical marketing, and R&D within lithography and advanced materials. Nick holds a Master’s degree in Chemical Engineering from Chung Yuan Christian University.