Dynex Semiconductor Limited
Songlin Yang is a Senior SiC Chip Design & Development Engineer at Dynex Semiconductor Ltd since August 2019, where responsibilities include leading SiC chip projects. Prior experience includes a role as a Visiting Researcher at the University of Cambridge from October 2019 to September 2020 and a position as a Silicon Carbide Chip Processing Engineer at Zhuzhou CRRC Times Electric Co., Ltd. from July 2017 to July 2019. Songlin Yang holds a Master's degree in Condensed Matter Physics and a Bachelor's degree in Applied Physics, both from Hunan University, awarded in 2017 and 2014, respectively.
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