Edem Kokou Adokanou

Edem Kokou Adokanou currently serves as an IC Assembly and Packaging Engineer at EM Microelectronic, overseeing IC packaging and quality for BackEnd Operations. Prior to this role, Edem held the position of Chip Packaging & Industrial Process Development Engineer at Presto Engineering Inc., focusing on advanced semiconductor packaging technologies and manufacturing processes. Earlier experience includes research in micro and nano-structural analysis of microelectronic failures at Thales Alenia Space, as well as internships in thermal studies and mechanical design. Edem holds a Doctorate in Numerical Mechanics and Materials from Mines Paris - PSL, alongside a Master’s degree from Universite de Lorraine and an engineering degree from Ecole Nationale Supérieure d'Ingénieurs de Lomé.