Steve Anderson

Steve Anderson has extensive work experience as a process engineer in various companies. Steve worked as a Senior Process Engineer at Engent, Inc. from January 2018, where the details of their role are not provided. Prior to that, they worked at Teledyne Technologies Incorporated as an Engineer 3 from September 2014 to December 2017. Steve also had a long tenure at Endicott Interconnect Technologies, Inc. from July 2006 to August 2014, where they served as a Process Engineer specializing in wire and wedge bonding, and flip chip die attach. Steve worked at Ametek Aerospace as a Manufacturing Engineer from July 2005 to June 2006, managing the production and technical problem resolution for various aircraft components. Steve was also a Process Engineer at Endicott Interconnect Technologies / i3, Inc. from November 2002 to June 2005. Steve began their career at IBM in June 1982 and held various Process Engineer roles until November 2002, focusing on manufacturing processes for chip carrier solder bumping, wire bonding, and flip chip on flex.

Steve Anderson attended Michigan Technological University from 1978 to 1982, where they obtained a Bachelor of Science degree in Mechanical Engineering.