Essig Research
Herven Barham is a skilled engineer with a Bachelor of Science in Mechanical Engineering from the University of Illinois Urbana-Champaign. Currently serving as a Life Analysis Engineer at Essig Research since January 2022, Herven also held the position of Large Military Repair Engineer. Prior experience includes working as a Supply Quality Engineer at Plexus Corp. from April 2021 to January 2022, where responsibilities involved inspecting medical devices in compliance with ISO 9001 standards. Additionally, Herven completed a Mechanical Engineering Internship at Eaton in 2018, managing test requests and system updates, and served as a Lab Aide at College of DuPage, providing support in computer lab classrooms. Early education includes a high school diploma in Engineering from Metea Valley.