Herven Barham

Life Analysis Engineer at Essig Research

Herven Barham is a skilled engineer with a Bachelor of Science in Mechanical Engineering from the University of Illinois Urbana-Champaign. Currently serving as a Life Analysis Engineer at Essig Research since January 2022, Herven also held the position of Large Military Repair Engineer. Prior experience includes working as a Supply Quality Engineer at Plexus Corp. from April 2021 to January 2022, where responsibilities involved inspecting medical devices in compliance with ISO 9001 standards. Additionally, Herven completed a Mechanical Engineering Internship at Eaton in 2018, managing test requests and system updates, and served as a Lab Aide at College of DuPage, providing support in computer lab classrooms. Early education includes a high school diploma in Engineering from Metea Valley.

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Milford, United States

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Essig Research

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Essig Research is a leading provider of high-tech engineering and manufacturing services. Our professional services team leverages technical expertise to develop value-driven, creative solutions resulting in long-standing customer relationships. Our services include: Product Lifecycle Management (PLM) Research & Development (R&D) Preliminary Design / Analysis (PDA) Product Definition Engineering (PDE) Test Facility Engineering (TFE) New Product Introduction (NPI) Maintenance, Repair & Overhaul (MRO) Government Contract Services (GCS)


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51-200

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