Yong Kim

VP, Engineering at Everspin Technologies

Yong is responsible for product design including design and engineering. Yong is a 27-year veteran of the semiconductor industry and came to Everspin most recently from Cypress Semiconductor where he was Vice President of Design leading worldwide development of 3D NAND products. Kim also spent several years at Spansion and AMD prior to Spansion’s acquisition by Cypress.

Kim holds a master’s degree in Electrical Engineering from Santa Clara University and a bachelor’s degree, also in Electrical Engineering, from Oregon State University.


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