Erich Daniel Morais

Erich Daniel Morais has a diverse work experience spanning several industries and roles. In 2016, they worked as an Engineering Process intern at Mundial SA, where they provided support for engineering services across various areas of the factory. Erich was subsequently hired as a full-time employee. In 2019, Erich worked as a Research Initiation Fellow at FAPERGS, focusing on 3D modeling-assisted endodontic treatments. During this time, they were recognized as a distinguished student in the field of Exact Sciences. Concurrently, Erich also worked as an R&D intern at Instituto SENAI de Tecnologia em Mecatrônica from August 2019 to September 2020. In 2020, they worked as a Programmer of Embedded Systems at Comlink Equipamentos Eletrônicos until April 2021. Currently, Erich serves as a Software Engineer at Everysk Technologies in New York City, where they contribute to the development of front office automation tools for investment funds.

Erich Daniel Morais pursued their education in a chronological order. Erich began their education in 2014, attending SENAI Mecatrônica, where they obtained a degree in Tecnologia em Robótica as a Mecatrônica Technician until 2015. Following that, from 2015 to 2020, they attended the UCS - University of Caxias do Sul, where they obtained a degree in Engenharia de Computação (Computer Engineering).

In terms of additional certifications, Erich Daniel Morais obtained several certifications. In March 2020, they received a certification in "Como controlar seu dispositivo IoT utilizando Amazon Alexa" from Microchip Technology Inc. Later in the same month, they obtained a certification in "Implementando uma rede sem fio com Topologia Mesh" from the same institution. In April 2020, they gained a certification in "API Rest em NodeJS aplicando testes (TDD) desde o início" from Udemy. Lastly, in February 2021, they obtained a certification in "FreeRTOS - Sistema Operacional de Tempo Real com ESP32 e SDK-IDF" from Microgenios.