Bo Zhou

Bo Zhou is a seasoned engineering professional with extensive experience in package development and process integration. Currently serving as a Senior Engineer and Package Team Leader at Fingerprint Cards since August 2017, Bo has led projects that enhance packaging solutions. Prior to this role, Bo worked as a Package Development Engineer at 昆山丘钛微电子科技有限公司 for one year and served as the Package Process Integration Engineer Team Leader at 苏州晶方半导体科技股份有限公司 for over three years. Bo holds a Bachelor's degree in Electronic Information Engineering from Anhui University of Technology, earned between September 2006 and July 2010.