Endy Lan is a Senior Manager of Thermal/Acoustic Engineering at Flex TDC, where they lead a team focused on thermal and acoustic design solutions for various advanced technology products. They established the first Flex thermal lab in Asia and enhanced facilities for liquid cooling validation. With a strong background in thermal engineering, Endy has previously held roles at MSI and Tatung, working on thermal solutions for major industry players such as IBM, Dell, and HP. Endy earned a Bachelor's degree in Mechanical Engineering from Tamkang University and a Master's degree in Thermal & Flow Dynamics from Tatung University.
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