Brandon Boiko

Brandon Boiko has a diverse range of work experience. Brandon is currently employed by FormFactor Inc. as a Senior Principal Application Engineer, where they have been since July 2021. Prior to this role, they served as a Principal Mechanical Engineer at FormFactor Inc. from October 2020 to July 2021. At High Precision Devices, Inc. (HPD), they worked as a Mechanical Engineer II from January 2018 to October 2020, where they contributed to designing and integrating various systems. Brandon also worked as a Mechanical Engineering Intern at HPD from May 2015 to December 2017, during which they undertook design projects, including cryostats. Before joining HPD, they served as the HELIOS IV Structures Lead at the University of Colorado from May 2014 to September 2015, where they designed and built a payload for the Colorado Space Grant Consortium. Brandon began their career at Hirsh Precision Products, Inc. as a Machinist from August 2013 to August 2014.

Brandon Boiko attended the University of Colorado Boulder from 2012 to 2017, where they earned a BS/MS degree in Mechanical Engineering. In addition, they hold a certification as a Certified SolidWorks Associate.