Chang-Yun (William) Wang

Process Integration Engineer, Optoelectronics Group at Global Compound Semiconductor

Chang-Yun (William) Wang has worked in a variety of roles since 2014. In 2014, they worked as a Technician Intern at P&L Grinding Wheel Co. In 2015, they worked as an Exchange Research Student at National Taiwan University, where they focused on the application of chemical soft lithography. In 2016, they worked as a Technical Service Intern at Impax Laboratories. In 2017, they worked as a Maintenance and EH&S Intern at The Dow Chemical Company and a Research Student at Cornell University College of Engineering, where they formulated gold nanoparticles with various ligands and ligand exchanged gold nanoparticles with photochemically sensitive species. In 2018, they worked as a Process Integration Engineer in the Optoelectronics Group at Global Communication Semiconductors, Inc.

Chang-Yun (William) Wang holds a Master of Engineering (MEng) in Chemical Engineering from Cornell University, which they obtained in 2018. Prior to that, they obtained a Bachelor of Science (BS) in Chemical Engineering from the University of Illinois Urbana-Champaign in 2017.

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Ithaca, United States

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Global Compound Semiconductor

Global Compound Semiconductor is a semiconductor wafer foundry service provider.


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51-200

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