Gary Hartzell

Gary Hartzell currently serves as Senior Vice President, Platform Engineering at Global Payments Inc., overseeing the foundational infrastructure and services that facilitate payment service deployment. Previously, Gary held the role of Senior Vice President, Global Technology Services, managing technology delivery for the North America Issuer business segment. At TSYS, Gary progressed from an Associate Project Director to Vice President of Global Technology Services, where responsibilities included leading engineering teams and ensuring the security and compliance of critical technologies. Earlier, Gary served as a First Sergeant in the US Army and holds a Bachelor of Applied Science in Business Administration from Troy University.