Global Unichip Corp
Justin Hsieh currently serves as Vice President of Packaging & Testing Engineering and Quality & Reliability Assurance.
Mr. Hsieh joined GUC in 2006. He has over 30 years of experience in operations, IC/SoC packaging & testing engineering, quality & reliability assurance, and program management in semiconductor industry. Prior to joining GUC, Mr. Hsieh accumulated 18 years of experiences in UMC, Mosel Vitelic, and ITRI.
Mr. Hsieh received his master degree in Photonics Engineering from National Chiao Tung University in 1989.
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Global Unichip Corp
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Global Unichip Corporation is a Taiwan-based company principally engaged in the research and development, production, testing and sales of application-specific integrated circuits (ASICs) and wafers. The application-specific integrated circuits (ASICs) and wafers are applied in customer-tailored wafer production, packaging and testing business. The company is also engaged in the provision of product-related and customer commissioned technical services. In addition, The Company is also engaged in the provision of technological support and consulting services related to products.