Justin Hsieh

Justin Hsieh currently serves as Vice President of Packaging & Testing Engineering and Quality & Reliability Assurance.

Mr. Hsieh joined GUC in 2006. He has over 30 years of experience in operations, IC/SoC packaging & testing engineering, quality & reliability assurance, and program management in semiconductor industry. Prior to joining GUC, Mr. Hsieh accumulated 18 years of experiences in UMC, Mosel Vitelic, and ITRI.

Mr. Hsieh received his master degree in Photonics Engineering from National Chiao Tung University in 1989.