Mario I.

Mario I. is currently working as the Director of Global Package Development and Engineering at Godiva Chocolatier. Prior to their current role, Mario held the position of Regional Package Development & Engineering Manager at pladis Global. Mario has extensive experience in packaging engineering, having worked as a Packaging Engineering Manager at Godiva Chocolatier and as a Packaging Engineer at K'NEX Industries. Mario also has experience as a Project Engineer at Skee Ball, Inc. Mario holds a Masters in Business Administration from Alvernia University and a BS in Mechanical Engineering from Florida State University.