Marc Hoisington

Packaging Engineer at Gpd Optoelectronics Corp

Marc Hoisington is an experienced engineering professional with a strong background in manufacturing and packaging engineering. Currently serving as a Packaging Engineer at GPD Optoelectronics Corp. since August 2021, Marc previously held positions at SemiGen, Inc. and MACOM, where responsibilities included designing automated processes to enhance yield and throughput, creating schematics for various manufacturing operations, and overseeing mechanical development. Earlier roles at Cobham Advanced Electronic Solutions and Aeroflex involved similar duties in automated dispensing and pick-and-place technologies. Marc's career began at Vectron International as a Process Engineer and progressed through various technical roles, including Group Leader and Assembly Technician, where extensive experience was gained in assembly, testing, and process optimization. Marc's educational background includes attendance at Pinkerton Academy.

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