Ryan Smith

Ryan Smith possesses extensive experience in the engineering field, currently serving as a New Technology Development Engineer at Graham Packaging since March 2013. Prior to this role, Ryan worked as a Test Technician at TE Connectivity from 2007 to 2013. Educationally, Ryan holds a Bachelor of Applied Science in Electrical Engineering Technology from Penn State University, obtained in 2012, as well as an Associate of Science in Nanofabrication Manufacturing Technology from Penn State University completed in 2008. Additionally, Ryan earned an Associate of Science in Electrical, Electronic and Communications Engineering Technology from HACC, Central Pennsylvania's Community College, in 2007.