Daniel Chew

Partner, Head Of Asia Group at HLK

Daniel Chew has a diverse and extensive work experience in the field of patent law and electronic patent matters. Daniel is currently serving as the President of the Chartered Institute of Patent Attorneys, and has previously held the positions of Vice President and Chair of CIPA's International Liaison Committee China Working Group. Prior to their involvement with CIPA, Daniel worked as a Partner and Head of Asia Group at HLK, specializing in building and maintaining client relationships in the patent attorney field. Daniel has also worked as a Partner at Haseltine Lake LLP, where they focused on electronic patent matters and had expertise in mobile and communications systems inventions. Before that, they served as a Patent Attorney and Senior Associate at Withers & Rogers LLP, specialising in electronic patent matters and representing clients in various patent offices. Daniel began their career as an Associate at Marks & Clerk and has also worked at other organizations such as Deqi Intellectual Property Law Corporation, Geonix Technology Limited, Mobile VCE and University of Surrey, and University of Newcastle. Throughout their career, Daniel has shown passion and commitment in their work, with a particular interest in the Asia market.

Daniel Chew earned their Diploma in Mechatronics (with Merit) from Temasek Polytechnic in 1998. From 1998 to 2000, they attended the University of Surrey, where they obtained a Bachelor of Engineering (Honors) in Electronics and Electrical Engineering. Daniel then pursued their higher education at the University of Surrey - Centre for Communications System Research from 2000 to 2004. During this time, they completed a PhD in Mobile Communications.

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Timeline

  • Partner, Head Of Asia Group

    May, 2019 - present

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