Roy Furbank

Vice President, Process Engineering at Hemlock Semiconductor

Roy Furbank has extensive experience in process engineering and technology leadership roles. Roy served as Vice President of Process Engineering at Hemlock Semiconductor, overseeing production capabilities. Prior to this, they held positions at Axalta, The Dow Chemical Company, Rohm and Haas, and the US Army, where they honed their skills in process development, product scale-up, and operational improvement. Their background includes managing global teams, implementing technology strategies, and leading innovation projects.

Roy Furbank earned a Bachelor of Science degree in Chemical Engineering from The University of Texas at Austin from 1990 to 1995. Subsequently, they completed their Ph.D. in Chemical Engineering at the Georgia Institute of Technology from 1999 to 2004.

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Timeline

  • Vice President, Process Engineering

    November, 2023 - present