Seungcheol Lee

Seungcheol Lee is an experienced professional in the field of adhesive technology, currently serving as the head of Application Engineering in Packaging Adhesive for the Asia Pacific region at Henkel since March 2008. Prior to this role, Seungcheol held positions as a Senior Manager in Technical Services and Technical Manager for Industrial Adhesives in Korea. Seungcheol's career includes a notable tenure at National Starch & Chemical where project leadership in new business development projects and the establishment of a PUR lab in Korea were key accomplishments. Additionally, positions as a Product Development Engineer at Kangnam Chemical allowed Seungcheol to focus on the development of PU coatings and adhesives. Seungcheol holds a master's degree in Chemical Engineering from Hanyang University and has furthered education at IESE Business School.