Arvind Krishna

Arvind Krishna has a diverse work experience spanning several companies and roles. Arvind is currently serving as the SVP of Hardware at HEVO since April 2023. Prior to that, Arvind worked as the Engineering Director at Kymeta Corporation from December 2020 to April 2023. Arvind also held the position of Director of Engineering and Process Development at Graham Packaging from January 2019 to December 2020. Before that, Arvind served as the Global Head of Engineering and Product Development at Oerlikon Surface Solutions from 2015 to 2018.

In their earlier career, Arvind worked at Enphase Energy as the Director of Mechanical Engineering and Engineering Services from September 2013 to August 2015. Arvind played a key role in developing and launching the next generation of Solar Microinverters and also initiated storage solution development. Prior to that, they held various roles at Delphi, including Global Engineering Manager from 2011 to 2013, Staff Hardware Engineer from 2007 to 2011, and Staff Research Engineer from 2003 to 2007.

Arvind started their career at General Motors as a Mechanical Analysis Engineer from 1995 to 2003. Prior to that, they worked as an Engineering Intern at Battelle, where they contributed to fracture mechanics research for nuclear piping and generated new guidelines for the Nuclear Regulatory Commission. Arvind also worked as a Research Associate at The Ohio State University from 1989 to 1995.

Arvind Krishna completed their education in mechanical engineering. Arvind started their academic journey at the Indian Institute of Technology, Madras from 1985 to 1989, where they obtained a BTech degree. Arvind continued their studies at The Ohio State University from 1989 to 1991, earning an M.S. in Mechanical Engineering. Arvind then pursued a Ph.D. in Mechanical Engineering at The Ohio State University from 1989 to 1995.