Daniel Ewing is a senior engineer specializing in materials science, particularly in semiconductors, microelectronic devices, and sensors. Ewing has extensive experience in product development and technology transition, serving as the technical lead for multiple projects focused on material characterization and device fabrication. Ewing holds a BS in Materials Science from Brown University and a PhD in Materials Science and Engineering from Carnegie Mellon University. Currently, Ewing works at Honeywell FM&T, having previously held roles at Northrop Grumman and the US Army Research Laboratory after completing their graduate studies.
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