Jack Hui Jack Hui is a curious innovator, technologist, and program manager with extensive experience in materials science and engineering. As a Ph.D. Researcher at DOE Ames Lab / Iowa State University from 2003 to 2007, Jack designed and synthesized advanced materials and earned recognition for contributions to the field. Following this, Jack served as Chief Engineer at TDK from 2008 to 2012, leading teams that achieved significant market capture and process improvements. Jack currently holds the position of Circular Material Innovation Lead at HP, where they focus on developing sustainable materials and enhancing product quality across multiple initiatives.
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