Xingliang Wu

Xingliang Wu is a Principal Engineer at 华为 since May 2022, with prior experience at Microsoft as a Senior Engineer focused on HoloLens custom purpose chip verification from February 2019 to April 2022. Earlier roles include Senior Engineer at Qualcomm, where work involved UVM test bench development and ETM ARM architecture verification from November 2016 to February 2019, and Design Engineer II at AMD from May 2013 to October 2016, contributing to projects like AMD Excavator and AMD StoneyX. Xingliang Wu began an academic journey at the University of Illinois Urbana-Champaign, earning a Bachelor of Engineering in Computer Engineering between 2010 and 2012.