Deying Xia has extensive experience in the field of microscopy and nanotechnology, beginning as a Research Associate at MIT from November 2008 to December 2011, focusing on directed self-assembly and semiconductor processing. From June 2006 to October 2008, Deying Xia served as a Post-doctoral Fellow at the University of New Mexico, specializing in nanofluidic devices and nanofabrication. At ZEISS Microscopy from January 2012 to May 2015, Deying Xia worked as a Process Engineer and later as an Application Specialist, gaining expertise in ion beam microscopy and failure analysis. Deying Xia furthered capabilities at ZEISS Semiconductor Manufacturing Technology as a Remote Optics Metrology Engineer from August 2020 to May 2022 and currently holds the position of Characterization Engineer at IBM since February 2022, involved in microscopy imaging and semiconductor device analysis. Deying Xia obtained a Ph.D. in Electrical Engineering and a Master's degree in Chemical Engineering from The University of New Mexico.
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