Ridip Choudhury

Ridip Choudhury has extensive experience in software development and release management, currently serving as a Software Release Manager at IBM since May 2014, where responsibilities include defining release processes, training teams, and ensuring compliance. Previously, Ridip held roles as a Principal Quality Assurance Engineer at IBM, focusing on test creation and automation, and as a Customer Engineer and Application Packaging Engineer at Fiberlink Communications, where duties involved product demonstrations, customer onboarding, and packaging management. Earlier experience at Wipro Technologies included positions as Module Leader, On Site Coordinator, and Project Engineer, focusing on team mentoring, requirement analysis, and software development. Ridip holds a Master of Computer Applications from Cochin University of Science and Technology and a Bachelor of Science from Hindi College - Delhi University.