Ryan Peng is an accomplished electrical and electronics engineering graduate from Texas A&M University, achieving Cum Laude honors. Experience includes roles as an Undergraduate Researcher at Texas A&M University College of Engineering, an Embedded Systems Assistant at DARPA, and an Electrical Hardware Intern at Hewlett Packard Enterprise, where Ryan developed a breakout board for performance evaluation of e-fuses. As a Hardware Developer at IBM, responsibilities include advancing hardware projects, while contributions to Texas A&M Solar Car Racing as a Power Distribution Member involved designing power distribution boards and leading PCB design sessions for electrical engineers.
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