Ryan Thorpe

Ryan Thorpe has worked in the semiconductor industry since 1999. Ryan began their career at Kyocera America Inc as a Packaging Engineer in 1999. In 2004, they joined Texas Instruments as a Director of Semiconductor Package Technology Development. Ryan then held various individual and manager roles in Packaging Technology Development, as well as Manager roles in New Package Technology Ramp, Packaging R&D Lab, and Packaging Technology Development. In 2012, they were an expat Manager of Assembly Site Packaging Technology and New Product Development. In 2022, they joined iDEAL Semiconductor as the Vice President of Package Engineering.

Ryan Thorpe received their Bachelor's degree in Mechanical Engineering from UC San Diego and their Master's degree in Mechanical Engineering from the Georgia Institute of Technology.