Dev Palmer

Dev Palmer is an accomplished professional in the field of electronics and advanced manufacturing, currently serving as the Director of the National Advanced Packaging Manufacturing Program at CHIPS for America R&D Office since July 2024. With a long-standing involvement in IEEE since 1989, Dev has held various leadership roles, including Fellow status as of 2012 and Life Fellow status in 2024, and has received numerous accolades, such as the 2013 IEEE Region 3 Outstanding Service Award. Prior to the current position, Dev was the Managing Director of the Next-Generation Microelectronics Manufacturing at DARPA, receiving the 2024 DARPA Superior Public Service Medal. Dev's extensive experience also includes leadership roles at Lockheed Martin, Duke University, and the US Army Research Office, along with a strong academic background with a Ph.D. in Electrical Engineering from Duke University.