Bum Soo Kim

Bum Soo Kim is a seasoned PCB materials engineer at Intel Corporation, with experience in global supply chain management and a focus on printed circuit board materials engineering since September 2008. Responsibilities include serving as Intel's PCB NPI technical consultant, collaborating with PCB suppliers to ensure quality and reliability, leading task forces to troubleshoot PCB process issues, and overseeing PCB supplier selection and qualification testing. Prior to this role, Bum Soo Kim held positions as a group leader and engineering manager in various semiconductor processes, as well as a process engineer in copper chemical mechanical planarization. Academic qualifications include a PhD in Chemical Engineering from Purdue University, a Master's degree in Chemical and Biomolecular Engineering from the Korea Advanced Institute of Science and Technology, and a Bachelor's degree in Chemical Engineering from Sogang University.