Feng Wei

Feng Wei possesses extensive experience in software engineering and management, currently serving as a Senior Program Manager and Software Engineering Manager at Intel Corporation since May 2012. Prior roles include Senior DSP Firmware Engineer at Echologics Engineering Inc., Senior Manager of BSP/Firmware Development at Flextronics, and Software Developer at Christie Digital Systems. Additional experience includes managing embedded software and project management at Logitech, and serving as Vice President of Engineering at GAO Research Inc. Previously, Feng Wei held key engineering positions at Stoval Technologies Pte Ltd. and China RIDA System Equipment Corporation. Educational background includes a Bachelor's degree in Automation from Tsinghua University, completed in 1990.