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Garo Derderian

Technology Transfer Lead: Interposser (EMIB/FOVEROS) LifeCycle TD to HVM

Garo Derderian is a Technology Development to Production Lead at Intel Corporation, where they currently manage the transfer of advanced packaging technologies, including EMIB and FOVEROS, from development to high-volume manufacturing. Garo's past experience includes roles as a Yield Engineer at Intel, a Manager of 7nm Fin/Gate Process Integration at GLOBALFOUNDRIES, and a Lead Integration Engineer at Lockheed Martin Space Systems Company. With a strong foundation in materials science, Garo has optimized various semiconductor processes and led teams to enhance yield and performance. They hold a BS and MS in Materials Science from the University of California, Los Angeles, and are pursuing a PhD in Materials Science and Engineering at UC Irvine.

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Albuquerque, United States

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