Juan Dominguez possesses extensive experience in package development and engineering, currently serving at Intel Corporation since January 2024 in the Advanced Package Development - Si Photonics role, focusing on 2.5D and 3D technology improvements. Prior to this, Dominguez was a Senior Principal Packaging Engineer at Medtronic, developing next-generation packaging for medical devices from August 2021 to February 2024. Dominguez previously held various positions at Intel Corporation from January 2003 to August 2021, including Package R&D Engineer, Package Quality and Reliability Engineer, Factory Quality and Reliability Engineer, and Materials Engineer, contributing significantly to new package introductions, quality assessments, and problem-solving initiatives. Academic qualifications include a PhD in Materials Science from the University of Michigan, an MBA from Babson F.W. Olin Graduate School of Business, and a BS in Chemical Engineering from the University of California, Berkeley.
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