Krishna Pandey

Packaging Research And Development Engineer at Intel

Krishna Pandey is a Packaging Research and Development Engineer at Intel Corporation since January 2024, with prior experience as a Mechanical Designer at Huld from March 2020 to January 2024. During a tenure as a Graduate Teaching Assistant at Portland State University from March 2023 to December 2023, Krishna contributed to academic support in engineering courses. A Junior Researcher at AB Bayrock from April 2019 to November 2019, Krishna focused on the effects of tilting angle on penetration depth in welding processes. Experience includes a role as Purchasing and Logistics Manager at LUT University, where a project involved developing a sensor-equipped dog agility hurdle, and previous work as a Thesis Worker at HAMK Häme University of Applied Sciences, creating a factory layout simulation for KUKA robots. Educational qualifications include a Graduate Certificate in Semiconductor Materials and Manufacturing and a Master's degree in Sustainable Production in Mechanical Engineering from LUT University, as well as a Bachelor's degree in Mechanical Engineering from HAMK.

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Intel

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Intel put the silicon in Silicon Valley. For more than 50 years, Intel and its people have had a profound influence on the world, driving business and society forward by creating radical innovation that revolutionizes the way we live. Intel’s mission is to shape the future of technology to help create a better future for the entire world. By pushing forward in fields like AI, analytics and cloud-to-edge technology, Intel’s work is at the heart of countless innovations. From major breakthroughs like self-driving cars and rebuilding the coral reefs, to things that make everyday life better like blockbuster effects and improved shopping experiences — they’re all powered by Intel technology. Today Intel is applying their reach, scale, and resources to enable customers to capitalize more fully on the power of digital technology. Inspired by Moore’s Law, they continuously work to advance the design and manufacturing of semiconductors to help address their customers’ greatest challenges. By embedding intelligence in the cloud, network, edge, and every kind of computing device, Intel unleashes four superpowers: AI, pervasive connectivity, cloud to edge, and ubiquitous computing. These four extraordinary technological capabilities have become major market forces powering the digitization of everything.