Intel
Krishna Pandey is a Packaging Research and Development Engineer at Intel Corporation since January 2024, with prior experience as a Mechanical Designer at Huld from March 2020 to January 2024. During a tenure as a Graduate Teaching Assistant at Portland State University from March 2023 to December 2023, Krishna contributed to academic support in engineering courses. A Junior Researcher at AB Bayrock from April 2019 to November 2019, Krishna focused on the effects of tilting angle on penetration depth in welding processes. Experience includes a role as Purchasing and Logistics Manager at LUT University, where a project involved developing a sensor-equipped dog agility hurdle, and previous work as a Thesis Worker at HAMK Häme University of Applied Sciences, creating a factory layout simulation for KUKA robots. Educational qualifications include a Graduate Certificate in Semiconductor Materials and Manufacturing and a Master's degree in Sustainable Production in Mechanical Engineering from LUT University, as well as a Bachelor's degree in Mechanical Engineering from HAMK.
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