May Nee Lim is an Advanced Packaging Senior Staff Engineer at Intel Corporation, where they are involved in technology transfer and tool installation for thin film metrology tools. Previously, they worked as a Senior Staff Engineer at Analog Devices Sdn. Bhd. and as a Senior Process Engineer at Unisem Chengdu, where they led teams and oversaw various processes in wafer bumping and product qualification. May holds a BSc in Chemical Engineering from University Technology Petronas and has experience spanning multiple companies in semiconductor processing. Throughout their career, they have demonstrated a commitment to continuous improvement and operational excellence.
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