Qichang Wang is a Staff Packaging R&D Engineer with over five years of experience in semiconductor packaging, specifically in ball attach technology and patch-on-interposer assembly technology. They hold a PhD in Mechanical Engineering with a focus on precision metrology, having also served as a Graduate Research Assistant and Teaching Assistant during their academic career. At Intel Corporation, Qichang leads process development and improvement projects for high-volume manufacturing related to Xeon server products, demonstrating their expertise in dimensional metrology and data analysis. Prior experience includes research roles at multiple universities, where they contributed to advancements in fuel cell technology and precision calibration techniques.
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