Sunil Baliga is a Sr. Packaging R&D Engineer (Integration) at Intel Corporation, where they focus on innovating semiconductor packaging processes. Sunil developed a passion for electronics in high school, which led to a Bachelor of Engineering in Electrical, Electronics, and Communications Engineering, followed by a Master of Science and a Doctor of Philosophy in Electrical Engineering from Arizona State University. Their career includes roles at IBM Global Services as a Software Engineer and various positions at Intel, where they have contributed to process optimization, project management, and the integration of advanced technology. Sunil continues to deepen their expertise in semiconductors and engaging with related topics.
Location
Phoenix, United States
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