Wenchao Li is a Technical Program Manager at Intel Corporation, where they have spent over five years leading advanced substrate packaging technology from conception to high-volume manufacturing. They have played a key role in developing innovative solutions for AI and high-performance computing, ensuring effective collaboration among cross-functional teams. Wenchao's previous experience includes roles as a Supplier Manager and Sr. Process Engineer, where they specialized in process development and optimization for next-generation packaging technologies. They hold a Master of Science in Electrical and Computer Engineering and a Bachelor of Science in Biomedical Engineering from the Georgia Institute of Technology.
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