Yahya Alvi is a Senior Advanced Packaging R&D Engineer with a strong background in semiconductor packaging, process development, and high-volume manufacturing. With experience leading cross-functional teams, Yahya has driven significant yield improvements and qualified novel materials in Intel's advanced packaging initiatives. Prior roles include a Lab Assistant at UC San Diego, where Yahya contributed to research in nanoscale architectures, and an Integrated Biosystems Lab Intern at Intel, optimizing biosensor systems. Yahya holds a Master's degree in Nanoengineering, focusing on Molecular and Nanoscale Materials, from the University of California, San Diego.
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