JCET Group
David Woo is an experienced Senior Technical Program Manager at STATS ChipPAC since November 2014, focusing on pre-sales technical support and developing test strategies tailored to customer needs. Prior to this role, David served as Senior Manager of Test Engineering at Broadcom, where the establishment of a Test Development Department in Singapore was achieved within a year. With a long tenure at Teradyne (Asia) Pte Ltd from May 1997 to February 2011, David held various positions including Business Development Manager, Application Team Leader, and Application Engineer, contributing to service business growth in South Asia and supporting escalated customer issues. David holds a degree from Nanyang Technological University Singapore, where studies took place from 1991 to 1995.
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JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.