JCET Group
Emerson Tan is a seasoned professional with extensive experience in equipment engineering and management within the semiconductor industry. Currently serving as Team Lead and Senior Engineer at STATS ChipPAC Ltd. since June 2019, Emerson oversees the Lithography Equipment Engineering Team, specifically focusing on the eWLB assembly process for 300mm and 330mm wafers. Prior roles include Equipment Engineer at UTAC, where responsibilities included line sustaining and quality resolution, and Project Maintenance Engineer at ASE Group Global, focusing on preventative maintenance projects. Emerson's tenure includes significant contributions at Panasonic as a Senior Equipment Engineer, leading the molding BGA process, and at ChipMOS Technologies as an Assistant Equipment Engineer. Emerson began the career as Manufacturing Supervisor at Psi Technologies, ensuring production met budget, schedule, and quality standards. Emerson holds a Bachelor of Science in Electronics and Communications Engineering from the University of the East.
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JCET Group
JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.